반도체 장비/소재 (Semiconductor Equipment / Material)
- CMP : Chemical Mechanical Polishing Semiconductor Equipment
- Wet Cleaning System : Etching, Delamination, Particle removal Equipment
- Slurry : Semiconductor planarization polishing consumable materials used in the process
디스플레이 장비/소재 (Display Equipment / Material)
- Wet station : Wet chemical process equipment(Etcher, Developer, Stripper, Cleaner)
- Coater : PR(Photo Resist) Coating equipment before exposure process
- APP : Atmospheric Pressure Plasma cleaning device
- CO2 Cleaner
- Nano ZrO2 disporsed Material
Semiconductor Equipment / Material
- CMP : Chemical Mechanical Polishing Semiconductor Equipment
- Wet Cleaning System : Etching, Delamination, Particle removal Equipment
- Slurry : Semiconductor planarization polishing consumable materials used in the process
Display Equipment / Material
- Wet station : Wet chemical process equipment(Etcher, Developer, Stripper, Cleaner)
- Coater : PR(Photo Resist) Coating equipment before exposure process
- APP : Atmospheric Pressure Plasma cleaning device
- CO2 Cleaner
- Nano ZrO2 disporsed Material